EFEITO DA INCORPORAÇÃO DE NANOPARTÍCULAS DE COBRE EM UM SISTEMA ADESIVO CONVENCIONAL NAS PROPRIEDADES MICROBIOLÓGICAS, MECÂNICAS E ADESIVAS À DENTINA

Abstract

Objectives: This study evaluated the effect of addition of copper nanoparticles at different concentrations into a simplified etch-and-rinse (ER) adhesive system (Ambar [AM]) on antimicrobial activity (AMA), degree of conversion of adhesives discs (DC-d) and dentin-resin interface (DC-i), the ultimate tensile strength (UTS), 28-day cumulative water sorption (WS), solubility (So) and copper release (CR) as well as immediate (IM) and 1-year (1Y) resin–dentine bond strength (μTBS) and nanoleakage (NL). Methods: Seven experimental adhesive systems were formulated according to the addition of copper nanoparticles (0 [control], 0.0075, 0.015, 0.06, 0.1, 0.5 and 1%) in AM adhesive system. We tested the antimicrobial activity of synthesized adhesives against Streptococcus mutans using agar diffusion assays. For DC-d, specimens were constructed and tested after 24 h for FTIR and micro-Raman spectroscopy. For UTS, specimens were tested after 24 h and 28 days. For WS and So, after specimens build-up, they were stored in water and the properties measured for 28 days. For CR, specimens were stored in 2% nitric acid solution and the properties were measured for 28 days. The occlusal enamel of thirty-five molars was removed and adhesives were applied to dentine surface after 37% phosphoric acid etching. After composite resin build-ups, specimens were longitudinally sectioned to obtain resin–dentine bonded sticks (0.8 mm2). Specimens were tested in tension at 0.5 mm/min in IM or 1Y (μTBS). For NL, 2 bonded sticks from each tooth were prepared and analyzed under SEM in IM or 1Y. For DC-i, 2 bonded sticks were prepared and analyzed under micro-Raman spectroscopy. The μTBS and NL data of each adhesive were subjected to two-way repeated measures ANOVA. For UTS, WS, So, copper release, DC-d and DC-i data of each adhesive were subjected to a one-way ANOVA. Tukey’s post hoc test was used for pair-wise comparisons (α = 0.05). Results: The addition of copper nanoparticles provided antimicrobial properties to the adhesives at all concentrations (p < 0,05), and did not influence UTS, WS and SO (p > 0.05). Higher CR was observed in adhesives with higher concentration of copper nanoparticles (p < 0.05). The addition of 1% of copper nanoparticles decreased the DC-d and DC-i significantly. After 1Y, significant reductions of μTBS and increases of NL were observed in the control group (p < 0.05). Reductions of μTBS and increase of NL over time were not observed for copper-containing adhesives.Conclusions: The addition of copper nanoparticles in concentrations up to 0.5% in the simplified ER Ambar adhesive system may be an alternative to provide antimicrobial properties, increase the long-term stability of resin–dentine interfaces, 12 without reducing adhesives’ mechanical properties evaluated.